18118775. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18118775 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a method of manufacturing a semiconductor package. Here is a simplified explanation of the patent application:
- A buffer die is placed on a support carrier.
- Multiple memory dies are formed, each consisting of a body layer and an active layer on the surface of the body layer. The body layer includes a light transmitting region.
- The memory dies are stacked on the buffer die in a vertical direction to create a semiconductor device.
- The distances between the buffer die and the memory dies are measured by irradiating light on the semiconductor device in the vertical direction.
- A molding member is formed to encapsulate the semiconductor device.
Potential applications of this technology:
- Semiconductor packaging industry: This method can be used in the manufacturing of semiconductor packages, which are essential components in various electronic devices such as computers, smartphones, and automotive electronics.
Problems solved by this technology:
- Accurate distance measurement: The method allows for precise measurement of distances between the buffer die and the memory dies, ensuring proper alignment and functionality of the semiconductor device.
Benefits of this technology:
- Improved manufacturing process: The method simplifies the manufacturing process of semiconductor packages by providing a reliable way to measure distances and stack memory dies.
- Enhanced functionality: The inclusion of a light transmitting region in the body layer of the memory dies allows for better light irradiation and measurement accuracy.
- Cost-effective: By streamlining the manufacturing process, this method can potentially reduce production costs and increase overall efficiency in the semiconductor packaging industry.
Original Abstract Submitted
A method of manufacturing a semiconductor package includes disposing a buffer die on a support carrier; forming a plurality of memory dies, each of the plurality of memory dies having a body layer and an active layer on a surface of the body layer, wherein the body layer includes a light transmitting region; stacking the plurality of memory dies on the buffer die in a vertical direction to form a semiconductor device; measuring respective distances between the buffer die and the plurality of memory dies by irradiating light on the semiconductor device in the vertical direction; and forming a molding member encapsulating the semiconductor device.
