18516703. SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516703 titled 'SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER
Simplified Explanation
The patent application describes semiconductor processing apparatuses utilizing an electrostatic discharge (ESD) prevention layer to reduce ESD events between a semiconductor wafer and components of the apparatuses.
- The semiconductor processing apparatus includes a wafer handling structure supporting the semiconductor wafer during processing.
- An ESD prevention layer on the wafer handling structure consists of a first material and a second material with higher electrical conductivity.
- The second material's electrical conductivity is greater than that of the first material.
Potential Applications
- Semiconductor manufacturing
- Electronics industry
- Research and development in semiconductor technology
Problems Solved
- Prevention of electrostatic discharge events during semiconductor processing
- Protection of semiconductor wafers from damage
- Enhanced reliability of semiconductor processing equipment
Benefits
- Improved yield in semiconductor manufacturing
- Increased equipment lifespan
- Enhanced safety for semiconductor processing personnel
Original Abstract Submitted
Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
