18366914. SEMICONDUCTOR STRUCTURE simplified abstract (MEDIATEK INC.)

SEMICONDUCTOR STRUCTURE

Organization Name

MEDIATEK INC.

Inventor(s)

Yu-Tung Chen of Hsinchu City (TW)

Pei-Haw Tsao of Hsinchu City (TW)

Kuo-Lung Fan of Hsinchu City (TW)

Yuan-Fu Chung of Hsinchu City (TW)

SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18366914 titled 'SEMICONDUCTOR STRUCTURE

Simplified Explanation

The semiconductor structure described in the patent application includes a test structure with a test device and a test pad, where the distance between the test pad and the die area gradually increases from the center to the periphery in a specific direction.

• Semiconductor structure with test structure:

   - Includes a semiconductor wafer with a scribe line area, first die area, and second die area.
   - Test structure is located in the scribe line area.
   - Test structure consists of a test device and a test pad.
   - Test device mimics physical characteristics of a semiconductor device in the die area.
   - Test pad is electrically connected to the test device.
   - Distance between test pad and die area increases from center to periphery in a specific direction.

Potential Applications

The technology described in the patent application could be applied in the semiconductor industry for testing and quality control purposes.

Problems Solved

This technology helps in efficiently testing semiconductor devices by providing a test structure within the scribe line area, allowing for accurate evaluation of device performance.

Benefits

- Improved testing accuracy and efficiency. - Enhanced quality control in semiconductor manufacturing. - Cost-effective solution for testing semiconductor devices.

Potential Commercial Applications

"Semiconductor Test Structure for Improved Quality Control and Efficiency"

Possible Prior Art

There may be prior art related to semiconductor test structures for quality control and testing purposes, but specific examples are not provided in the patent application.

How does this technology impact the overall production process of semiconductor devices?

The technology described in the patent application could potentially streamline the testing process of semiconductor devices, leading to increased efficiency and reduced production costs.

What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing facilities?

Some potential challenges in implementing this technology on a large scale could include integration with existing manufacturing processes, scalability, and ensuring consistency in test results across different devices.

Original Abstract Submitted

A semiconductor structure is provided. The semiconductor structure includes a semiconductor wafer and a test structure. The semiconductor wafer has a substrate having a scribe line area, a first die area and a second die area. The first die area and the second die area are separated by the scribe line area extending along a first direction. The test structure is disposed in the scribe line area. The test structure includes a test device and a first test pad. The test device has a physical characteristic similar to a semiconductor device fabricated in the first die area or the second die area. The first test pad is electrically connected to the test device. A first distance between the first test pad and the first die area gradually increases from a center region to a peripheral region of the first test pad in the first direction.