18117848. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

JOO-YOUNG Oh of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18117848 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The abstract describes a semiconductor device that includes a semiconductor substrate with a device region and an edge region. It also includes a semiconductor component on the device region, a metal structure on the edge region, an insulating layer surrounding the semiconductor component and the metal structure, and a pad on the semiconductor component. The metal structure is surrounded by the insulating layer and is not exposed at a side surface of the insulating layer, and it is electrically insulated from the semiconductor component.

  • The semiconductor device includes a semiconductor substrate with a device region and an edge region.
  • A semiconductor component is placed on the device region.
  • A metal structure is located on the edge region.
  • An insulating layer surrounds the semiconductor component and the metal structure.
  • The metal structure is not exposed at a side surface of the insulating layer.
  • The metal structure is electrically insulated from the semiconductor component.

Potential Applications:

  • This semiconductor device can be used in various electronic devices such as integrated circuits, microprocessors, and memory chips.
  • It can be applied in power electronics, telecommunications, consumer electronics, and automotive electronics.

Problems Solved:

  • The insulating layer surrounding the metal structure prevents electrical contact between the metal structure and the semiconductor component, ensuring proper functioning and preventing short circuits.
  • The metal structure being surrounded by the insulating layer also protects it from external factors that could cause damage or interference.

Benefits:

  • The semiconductor device provides improved electrical insulation between the metal structure and the semiconductor component, enhancing the reliability and performance of the device.
  • The insulating layer surrounding the metal structure offers protection against potential short circuits and damage.
  • The design allows for efficient integration of the semiconductor component and metal structure, optimizing the overall functionality of the device.


Original Abstract Submitted

A semiconductor device includes a semiconductor substrate including a device region and an edge region; a semiconductor component on the device region; a metal structure on the edge region; an insulating layer surrounding the semiconductor component and the metal structure; and a pad on the semiconductor component, wherein the metal structure is surrounded by the insulating layer and is not exposed at a side surface of the insulating layer, and wherein the metal structure is electrically insulated from the semiconductor component.

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