17887273. SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS simplified abstract (Intel Corporation)

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SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS

Organization Name

Intel Corporation

Inventor(s)

Santosh Tripathi of Portland OR (US)

Tuyen Tran of Portland OR (US)

SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17887273 titled 'SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS

Simplified Explanation

Embodiments described in the patent application involve analyzing a wafer for defects using cross-section analysis by applying a sacrificial layer on the wafer surface before forming a cavity for analysis.

  • An epoxy material is placed into the cavity after analysis, and a capping layer is placed on top of the epoxy material.
  • The sacrificial layer, which may contain dislodged particles or debris, is then removed to provide a clean surface on the wafer for further processing.
    • Potential Applications:**
  • Semiconductor manufacturing
  • Quality control in wafer production
    • Problems Solved:**
  • Efficient defect analysis in wafers
  • Ensuring clean surfaces for further processing
    • Benefits:**
  • Improved quality control in manufacturing processes
  • Cost-effective defect analysis in wafers
  • Enhanced efficiency in wafer production.


Original Abstract Submitted

Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for analyzing a wafer for defects using cross-section analysis by applying a sacrificial layer on a surface of the wafer prior to forming a cavity into the wafer for analysis. In embodiments, an epoxy material may be placed into the cavity after analysis, and a capping layer placed on top of the epoxy material. The sacrificial layer, which may contain dislodged particles or debris from the formation of the cavity on its surface, is then removed, providing a clean surface on the wafer. The wafer may then be reintroduced into the manufacturing line for further processing. Other embodiments may be described and/or claimed.

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