17551266. IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Saumya Sharma of Easton CT (US)

Ruturaj Nandkumar Pujari of Albany NY (US)

Ashim Dutta of Clifton Park NY (US)

Chih-Chao Yang of Glenmont NY (US)

IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17551266 titled 'IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION

Simplified Explanation

The present invention relates to a system and method for providing localized process-based compensation on a semiconductor wafer. This is achieved through the use of in-situ wafer feedback schemes and systems.

  • The invention involves forming a plurality of test structures on the surface of a semiconductor wafer.
  • The semiconductor wafer is then placed under a detection surface of an in-situ feedback tool that includes one or more sensors.
  • The in-situ feedback tool measures a property of each test structure and determines a local condition of the semiconductor wafer for each measured property.
  • Based on the local conditions, a localized process-based compensation is provided on the surface of the semiconductor wafer.

Potential Applications

This technology has potential applications in the semiconductor industry, specifically in the manufacturing of semiconductor wafers. It can be used to improve the quality and performance of semiconductor devices by providing localized process-based compensation.

Problems Solved

One of the problems solved by this technology is the need for accurate and localized compensation during the manufacturing process of semiconductor wafers. By measuring the properties of test structures and determining local conditions, this technology allows for targeted compensation to address any variations or defects on the wafer surface.

Benefits

The use of in-situ wafer feedback schemes and systems provides several benefits:

  • Improved quality and performance of semiconductor devices by addressing localized variations and defects.
  • Enhanced manufacturing efficiency by providing targeted compensation instead of applying blanket corrections.
  • Cost savings by reducing the number of defective or subpar semiconductor wafers.

Overall, this technology enables more precise and effective control over the manufacturing process of semiconductor wafers, leading to higher quality and more reliable semiconductor devices.


Original Abstract Submitted

Embodiments of the present invention are directed to in-situ wafer feedback schemes and systems for providing localized process-based compensation on a semiconductor wafer. In a non-limiting embodiment of the invention, a plurality of test structures are formed on a surface of a semiconductor wafer. The semiconductor wafer is placed under a detection surface of an in-situ feedback tool comprising one or more sensors. The in-situ feedback tool measures a property of each of the plurality of test structures and determines a local condition of the semiconductor wafer for each measured property of the plurality of test structures. A localized process-based compensation is provided on the surface of the semiconductor wafer for each local condition.

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