17810036. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Unbyoung Kang of Hwaseong-si (KR)
Sechul Park of Bucheon-si (KR)
Teahwa Jeong of Hwaseong-si (KR)
Atsushi Fujisaki of Seongnam-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17810036 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes a semiconductor chip with a second bonding insulating layer surrounding certain components. The first bonding pad structure consists of a first contact portion, a first bonding pad, and a first seed layer. Similarly, the second bonding pad structure consists of a second contact portion, a second bonding pad, and a second seed layer. The second bonding insulating layer is in contact with the side surface of the first and second seed layers and the first and second bonding pads.
- The semiconductor package includes a semiconductor chip with a second bonding insulating layer.
- The first bonding pad structure consists of a first contact portion, a first bonding pad, and a first seed layer.
- The second bonding pad structure consists of a second contact portion, a second bonding pad, and a second seed layer.
- The second bonding insulating layer is in contact with the side surface of the first and second seed layers and the first and second bonding pads.
Potential Applications
- Semiconductor manufacturing industry
- Electronics industry
- Integrated circuit packaging industry
Problems Solved
- Provides insulation and protection for the bonding pad structures and seed layers.
- Ensures proper electrical connections between the bonding pads and contact portions.
- Reduces the risk of damage or short circuits during semiconductor packaging.
Benefits
- Improved reliability and durability of semiconductor packages.
- Enhanced electrical performance and signal integrity.
- Simplified manufacturing process for semiconductor chips.
Original Abstract Submitted
A semiconductor package includes a semiconductor chip including a second bonding insulating layer surrounding at least a portion of each of a first bonding pad structure and a second bonding pad structure, in which the first bonding pad structure includes a first contact portion, a first bonding pad, and a first seed layer disposed between the first bonding pad and the first contact portion and extending in a first direction, the second bonding pad structure includes a second contact portion, a second bonding pad, and a second seed layer disposed between the second bonding pad and the second contact portion and extending in the first direction, and the second bonding insulating layer is in contact with a side surface of each of the first and second seed layers and the first and second bonding pads.
