18462067. SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18462067 titled 'SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor chip described in the patent application includes a front end of line (FEOL) with an active layer, a back end of line (BEOL) with multiple metal layers including a wire, an optional dicing line for dicing, and an isolation block for processing signals for a discontinuous wire. The chip die has the active layer not formed around a cross section cut by the optional dicing line, improving production yield and reducing costs.
- Front end of line (FEOL) with active layer
- Back end of line (BEOL) with multiple metal layers including wire
- Optional dicing line for dicing
- Isolation block for processing signals for discontinuous wire
- Chip die with active layer not formed around dicing line cut
Potential Applications
The technology described in the patent application could be applied in the manufacturing of semiconductor chips for various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
Problems Solved
1. Improved production yield of semiconductor chips 2. Reduced production costs
Benefits
1. Increased efficiency in semiconductor chip manufacturing 2. Cost savings in production processes
Potential Commercial Applications
Optimizing Semiconductor Chip Manufacturing Processes for Cost Efficiency
Possible Prior Art
There may be prior art related to the optimization of semiconductor chip manufacturing processes to improve production yield and reduce costs, but specific examples are not provided in the patent application.
Unanswered Questions
How does the technology impact the overall performance of electronic devices using these semiconductor chips?
The patent application focuses on production yield and cost reduction, but it does not directly address how the technology may affect the performance of electronic devices utilizing these semiconductor chips.
Are there any potential drawbacks or limitations to implementing this technology in semiconductor chip manufacturing?
While the patent application highlights the benefits of improved production yield and cost reduction, it does not mention any potential drawbacks or limitations that may arise from implementing this technology.
Original Abstract Submitted
Provided are a semiconductor chip and a method of manufacturing a semiconductor package including the semiconductor chip. The semiconductor chip includes a front end of line (FEOL) including an active layer, a back end of line (BEOL) including a plurality of metal layers including a wire, an optional dicing line along which dicing is optionally performed, and an isolation block configured to process a signal for a discontinuous wire when the wire is discontinuous by being diced along the optional dicing line, and a chip die on which the active layer is not formed around a cross section cut by the optional dicing line. Thus, the production yield of the semiconductor chip may be improved, and the production costs thereof may be reduced.
