17839675. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Aenee Jang of Seoul (KR)

Yoonsung Kim of Seoul (KR)

Seungduk Baek of Hwaseong-si (KR)

Yunrae Cho of Guri-si (KR)

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17839675 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package that includes a base structure and a semiconductor chip. The base structure has a planar upper surface provided by an upper insulating layer and an upper pad. The semiconductor chip is placed on the planar upper surface and has a planar lower surface provided by a lower insulating layer and a lower connection pad. The chip also has a recess surface extending from one end of the side surface to one end of the planar lower surface. The low dielectric layer of the chip is spaced apart from the recess surface by the lower insulating layer.

  • The semiconductor package includes a base structure with an upper pad and an upper insulating layer.
  • A semiconductor chip is placed on the planar upper surface of the base structure.
  • The chip has a substrate, a wiring structure, a low dielectric layer, a lower connection pad, and a lower insulating layer.
  • The chip has a planar lower surface and a recess surface extending from one end of the side surface to one end of the planar lower surface.
  • The low dielectric layer of the chip is spaced apart from the recess surface by the lower insulating layer.

Potential Applications

  • This semiconductor package can be used in various electronic devices such as computers, smartphones, and tablets.
  • It can be applied in high-speed data transmission systems, where the low dielectric layer helps in reducing signal loss and improving performance.

Problems Solved

  • The semiconductor package solves the problem of signal loss by providing a low dielectric layer that is spaced apart from the recess surface.
  • It also solves the problem of efficient heat dissipation by providing a planar upper surface and a planar lower surface.

Benefits

  • The semiconductor package offers improved signal transmission and reduced signal loss due to the low dielectric layer.
  • It provides efficient heat dissipation through the planar upper and lower surfaces.
  • The package allows for compact and reliable integration of semiconductor chips into electronic devices.


Original Abstract Submitted

A semiconductor package is provided. The semiconductor package includes, a base structure including a body, an upper pad on the body, and an upper insulating layer on a side surface of the upper pad, the base structure having a planar upper surface provided by the upper insulating layer and the upper pad; and a semiconductor chip on the planar upper surface of the base structure, and including a substrate, a wiring structure below the substrate, a low dielectric layer on a side surface of the wiring structure, a lower connection pad below the wiring structure, and a lower insulating layer on a side surface of the lower connection pad, the semiconductor chip having a planar lower surface provided by the lower insulating layer and the lower connection pad, a side surface provided by the lower insulating layer and the substrate, and a recess surface extending from one end of the side surface to one end of the planar lower surface, wherein the low dielectric layer is spaced apart from the recess surface of the semiconductor chip by the lower insulating layer.

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