18373098. SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING simplified abstract (Tokyo Electron Limited)
Contents
- 1 SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
Organization Name
Inventor(s)
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18373098 titled 'SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
Simplified Explanation
The abstract describes a patent application for shifted multi-via connections, where contact array structures on two substrates are intentionally shifted to compensate for misalignment during bonding.
- The method involves providing contact array structures on two substrates, bonding the substrates together, and intentionally shifting portions of the contact array structures to compensate for misalignment.
- The shifted multi-via connections aim to improve the alignment accuracy and reliability of connections between the two substrates.
Potential Applications
The technology can be applied in various industries such as semiconductor manufacturing, electronics assembly, and microelectronics.
Problems Solved
The innovation addresses the issue of misalignment that commonly occurs during the bonding process of substrates, leading to unreliable connections and reduced performance.
Benefits
The shifted multi-via connections improve the overall alignment accuracy, reliability, and performance of electronic devices and systems.
Potential Commercial Applications
The technology can be utilized in the production of advanced electronic devices, circuit boards, sensors, and other microelectronic components.
Possible Prior Art
One possible prior art could be the use of alignment markers or fiducials to improve alignment accuracy in semiconductor manufacturing processes.
=== What are the specific materials used in the contact array structures? The specific materials used in the contact array structures are not mentioned in the abstract.
=== How does the intentional shifting of the contact array structures improve the overall performance of the bonded substrates? The intentional shifting of the contact array structures compensates for misalignment, ensuring better alignment accuracy and reliability of connections between the substrates.
Original Abstract Submitted
Shifted multi-via connections are disclosed. A method includes providing a first contact array structure on a first substrate. The first contact array structure includes a plurality of first contacts. The method includes providing a second contact array structure on a second substrate. The second contact array structure includes a plurality of second contacts configured to interface with the plurality of first contacts. The method includes bonding the first substrate to the second substrate. Portions of the first contact array structure, the second contact array structure or both the first and second contact array structures are intentionally shifted to compensate for misalignment that occurs during the bonding of the first substrate to the second substrate.
