17836678. METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR WAFER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR WAFER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Seunghyeok Son of Suwon-si (KR)
Sujin Lee of Gwangmyeong-si (KR)
Chan Gi Jeon of Hwaseong-si (KR)
METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR WAFER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17836678 titled 'METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR WAFER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The semiconductor wafer inspection method described in this patent application involves the following steps:
- A wafer with target and reference dies is provided.
- A candidate image of a specific region of the target die and a reference image of a specific region of the reference die are obtained.
- An imaging process is performed on both the candidate and reference images to obtain high-resolution versions with sub-pixels for each pixel.
- The high-resolution reference image is shifted in sub-pixel units.
- A difference image is generated by comparing the high-resolution candidate image with the shifted high-resolution reference image.
- A defect signal is generated based on the difference image, and it is determined whether this signal exceeds a threshold value.
Potential applications of this technology:
- Semiconductor wafer inspection and quality control in the manufacturing process.
- Detection of defects or abnormalities in semiconductor wafers.
Problems solved by this technology:
- Provides a more accurate and detailed inspection of semiconductor wafers by using high-resolution images with sub-pixels.
- Allows for precise comparison and detection of defects by shifting the reference image in sub-pixel units.
Benefits of this technology:
- Improved accuracy in detecting defects in semiconductor wafers.
- Enhanced quality control in the manufacturing process.
- Time and cost savings by automating the inspection process.
Original Abstract Submitted
A semiconductor wafer inspection method is provided. The semiconductor wafer inspection method includes: providing a wafer with target and reference dies; obtaining a candidate image of a first region of the target die and a reference image of a second region of the reference die; performing an imaging process on the candidate image to obtain a high resolution candidate image including sub-pixels for each pixel of the candidate image; performing the imaging process on the reference image to obtain a high resolution reference image including sub-pixels for each pixel of the candidate image; shifting the high resolution reference image in units of the sub-pixels; obtaining a difference image based on a difference between the high resolution candidate image and the high resolution reference image; and detecting whether a defect signal generated based on the difference image exceeds a threshold value.
