Taiwan semiconductor manufacturing co., ltd. (20240094282). CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract
Contents
- 1 CIRCUIT TEST STRUCTURE AND METHOD OF USING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT TEST STRUCTURE AND METHOD OF USING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT TEST STRUCTURE AND METHOD OF USING
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Ching-Fang Chen of Hsinchu (TW)
Chih-Hsien Lin of Hsinchu (TW)
CIRCUIT TEST STRUCTURE AND METHOD OF USING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094282 titled 'CIRCUIT TEST STRUCTURE AND METHOD OF USING
Simplified Explanation
The circuit test structure described in the patent application includes a chip with a conductive line tracing its perimeter, an interposer electrically connected to the chip, and a test structure connected to the conductive line. Additionally, there is a testing site that can be electrically connected to the conductive line.
- Chip with conductive line tracing perimeter
- Interposer electrically connected to chip
- Test structure connected to conductive line
- Testing site for electrical connection
Potential Applications
This technology could be applied in semiconductor testing, integrated circuit manufacturing, and quality control processes.
Problems Solved
This innovation helps in efficiently testing the functionality and connectivity of chips and interposers in electronic devices.
Benefits
The circuit test structure allows for easy and accurate testing of electronic components, leading to improved product quality and reliability.
Potential Commercial Applications
This technology could be utilized in the semiconductor industry for testing and quality assurance purposes.
Possible Prior Art
There may be existing circuit test structures with similar features, but further research is needed to identify specific prior art.
Unanswered Questions
How does this technology compare to traditional testing methods?
This article does not provide a direct comparison between this technology and traditional testing methods.
What are the potential limitations of implementing this circuit test structure?
The article does not address any potential limitations or challenges that may arise when implementing this technology.
Original Abstract Submitted
a circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. the circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. the circuit test structure further includes a test structure connected to the conductive line. the circuit test structure further includes a testing site, wherein the test structure is configured to electrically connect the testing site to the conductive line.
