US Patent Application 18359648. Optical Mode Optimization for Wafer Inspection simplified abstract
Contents
Optical Mode Optimization for Wafer Inspection
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Bing-Siang Chao of Hsinchu (TW)
Optical Mode Optimization for Wafer Inspection - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359648 titled 'Optical Mode Optimization for Wafer Inspection
Simplified Explanation
- The patent application describes a method for determining wafer inspection parameters. - The method involves identifying an area of interest in an IC design layout. - An inspection simulation is performed on the area of interest by generating multiple simulated optical images using different optical modes. - Based on the simulated optical images, at least one optical mode is selected for inspecting an area of a wafer that is fabricated based on the area of interest in the IC design layout.
Original Abstract Submitted
According to some embodiments, the present disclosure provides a method for determining wafer inspection parameters. The method includes identifying an area of interest in an IC design layout, performing an inspection simulation on the area of interest by generating a plurality of simulated optical images from the area of interest using a plurality of optical modes, and selecting, based on the simulated optical images, at least one of the optical modes to use for inspecting an area of a wafer that is fabricated based on the area of interest in the IC design layout.
