Samsung electronics co., ltd. (20240136231). APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract
Contents
- 1 APPARATUS FOR MEASURING AN ADHESION FORCE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR MEASURING AN ADHESION FORCE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
APPARATUS FOR MEASURING AN ADHESION FORCE
Organization Name
Inventor(s)
Seungdae Seok of Suwon-si (KR)
Byeongtak Park of Suwon-si (KR)
APPARATUS FOR MEASURING AN ADHESION FORCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136231 titled 'APPARATUS FOR MEASURING AN ADHESION FORCE
Simplified Explanation
The apparatus described in the patent application is designed to measure the adhesion force of a specimen by using a sensor adhered to the specimen. The sensor detects the force required to detach it from the specimen, providing a measurement of the adhesion force.
- The apparatus includes a stage to support the specimen.
- A sensor is attached to the specimen to detect the adhesion force.
- The adhesion force is the force needed to detach the sensor from the specimen.
Potential Applications
This technology could be used in various industries such as:
- Material science
- Biomedical research
- Quality control in manufacturing
Problems Solved
This technology helps in:
- Understanding adhesion properties of different materials
- Ensuring product quality by measuring adhesion forces accurately
Benefits
The benefits of this technology include:
- Precise measurement of adhesion forces
- Improved understanding of material properties
- Enhanced quality control processes
Potential Commercial Applications
This technology could be applied in:
- Research laboratories
- Manufacturing facilities
- Testing and inspection companies
Possible Prior Art
One possible prior art could be traditional methods of measuring adhesion forces using manual techniques or less accurate sensors.
Unanswered Questions
How does the sensor adhere to the specimen?
The patent application does not provide details on the specific mechanism used to adhere the sensor to the specimen.
What materials can be tested using this apparatus?
The patent application does not specify the types of materials that can be tested using this apparatus.
Original Abstract Submitted
an apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
