Samsung electronics co., ltd. (20240096777). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096777 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution structure with stacked redistribution layers and insulating layers. A semiconductor chip is connected to the redistribution layers, and bumps are connected to the redistribution layers and arranged on one surface of the redistribution structure. The redistribution layers have pads facing the bumps, with each pad having a first pad portion offset in one direction, a second pad portion offset in another direction, and a connection portion linking the two pad portions. The connection portion includes protruding portions defining recessed regions adjacent to the first and second pad portions.
- The semiconductor package includes a redistribution structure with stacked redistribution layers and insulating layers.
- A semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure.
- The redistribution layers have pads facing the bumps, with each pad having a first pad portion offset in one direction, a second pad portion offset in another direction, and a connection portion linking the two pad portions.
- The connection portion includes protruding portions defining recessed regions adjacent to the first and second pad portions.
Potential Applications
The technology described in the patent application could be applied in:
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
The technology addresses issues such as:
- Efficient electrical connections in semiconductor packages
- Improved reliability of semiconductor devices
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor devices
- Increased durability of semiconductor packages
Potential Commercial Applications
The technology could find commercial applications in:
- Consumer electronics
- Automotive industry
Possible Prior Art
One possible prior art could be the use of redistribution structures in semiconductor packaging to improve electrical connections and reliability.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
The article does not provide a direct comparison with existing semiconductor packaging methods, making it unclear how this technology stands out in the industry.
What are the specific manufacturing processes involved in implementing this innovation?
The article does not delve into the specific manufacturing processes required to implement this innovation, leaving a gap in understanding the practical aspects of its application.
Original Abstract Submitted
a semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. a semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. the redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. the connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.
