US Patent Application 17730585. AUTOMATIC OPTICAL INSPECTION SYSTEM AND METHOD simplified abstract
Contents
AUTOMATIC OPTICAL INSPECTION SYSTEM AND METHOD
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Lung Chen of Zhubei (TW)
Chien-Chi Tzeng of Hsinchu (TW)
AUTOMATIC OPTICAL INSPECTION SYSTEM AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17730585 titled 'AUTOMATIC OPTICAL INSPECTION SYSTEM AND METHOD
Simplified Explanation
- The patent application describes a method for forming an integrated circuit package. - The method involves attaching an integrated circuit die to a package substrate and placing a heat spreader over them. - The height of the integrated circuit package is between 2.5 mm and 6 mm. - A first automatic optical inspection (AOI) process is performed on the integrated circuit package using an AOI apparatus. - The AOI apparatus has a lens with a maximum depth of field greater than the height of the integrated circuit package. - During the first AOI process, the depth of field covers the entire height of the integrated circuit package. - The purpose of the AOI process is to determine if the orientation and alignment of the heat spreader with regards to the package substrate meet the specifications.
Original Abstract Submitted
A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.
