Samsung electronics co., ltd. (20240096841). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the technology impact the overall cost of semiconductor packaging?
- 1.11 What are the environmental implications of using the described semiconductor packaging technology?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Seunghoon Yeon of Suwon-si (KR)
Seungryong Oh of Suwon-si (KR)
Huiyeong Jang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096841 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip with through electrodes and bonding pads, a second semiconductor chip with wiring layers and bonding pads, conductive bumps for stacking the chips, an adhesive layer, and flow prevention structures in the adhesive layer.
- First semiconductor chip with through electrodes and bonding pads
- Second semiconductor chip with wiring layers and bonding pads
- Stacking of chips using conductive bumps
- Adhesive layer filling the space between the bumps
- Flow prevention structures in the adhesive layer
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging.
Problems Solved
This technology solves the problem of efficiently stacking multiple semiconductor chips while ensuring proper electrical connections between them. It also addresses the issue of preventing flow of adhesive material to sensitive test pad regions during the packaging process.
Benefits
The benefits of this technology include improved performance and reliability of semiconductor packages, reduced size and weight of electronic devices, and enhanced manufacturing efficiency in the production of semiconductor components.
Potential Commercial Applications
The technology described in the patent application could find commercial applications in the semiconductor industry for the development of advanced packaging solutions for high-performance electronic devices. A potential SEO-optimized title for this section could be "Commercial Applications of Semiconductor Package Technology".
Possible Prior Art
One possible prior art in semiconductor packaging technology is the use of conductive bumps for stacking multiple chips in a compact manner. Another prior art could be the use of adhesive layers to bond semiconductor chips together in a package.
Unanswered Questions
How does the technology impact the overall cost of semiconductor packaging?
The article does not provide information on how the new technology affects the cost of semiconductor packaging. This could be an important factor for companies looking to adopt this innovation in their manufacturing processes.
What are the environmental implications of using the described semiconductor packaging technology?
The environmental impact of the materials used in the semiconductor packaging process is not addressed in the article. Understanding the sustainability of the technology could be crucial for companies seeking to align with green initiatives and regulations.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip including a first substrate, a plurality of through electrodes penetrating the first substrate, and first bonding pads provided on one surface of the first substrate and electrically connected to the plurality of through electrodes, a second semiconductor chip including a second substrate, a second wiring layer provided on one surface of the second substrate and having redistribution pads and test pads, and second bonding pads on the redistribution pads, the second semiconductor chip being stacked on the first semiconductor chip via conductive bumps that are disposed between first and second bonding pads, an adhesive layer filling a space between the conductive bumps, and flow prevention structures in the adhesive layer on a test pad region where the test pads are disposed.
