Taiwan semiconductor manufacturing company, ltd. (20240136174). INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS simplified abstract
Contents
- 1 INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ming-Tung Wu of Hsinchu City (TW)
Hsun-Chung Kuang of Hsinchu City (TW)
Tung-He Chou of Hsinchu City (TW)
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136174 titled 'INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
Simplified Explanation
The present disclosure describes an integrated chip fabrication device with a stealth laser apparatus for creating a stealth damage region within a substrate.
- The device includes a stealth laser apparatus positioned over a chuck that holds the substrate.
- An infrared camera is used to detect an alignment mark beneath the substrate, which is then used to align the stealth laser apparatus.
- Control circuitry operates the stealth laser apparatus to create a stealth damage region within the substrate, separating an inner region from an outer region.
Potential Applications
The technology could be applied in semiconductor manufacturing, integrated circuit fabrication, and microelectronics production.
Problems Solved
This innovation helps in precisely creating a stealth damage region within a substrate, which can be useful for separating different regions within the substrate.
Benefits
The device allows for accurate alignment and creation of the stealth damage region, improving the overall quality and efficiency of the fabrication process.
Potential Commercial Applications
Potential commercial applications include semiconductor industry, electronics manufacturing, and research institutions.
Possible Prior Art
Prior art may include similar devices used in semiconductor fabrication processes or laser-based technologies for substrate modification.
Unanswered Questions
How does the alignment mark detection process work in detail?
The abstract mentions the use of an infrared camera to detect an alignment mark below the substrate, but the specific mechanism of this detection is not elaborated upon.
What materials are compatible with the creation of stealth damage regions using this technology?
The abstract does not specify the types of substrates or materials that can be effectively processed using the stealth laser apparatus.
Original Abstract Submitted
in some embodiments, the present disclosure relates to an integrated chip fabrication device. the device includes a stealth laser apparatus arranged over a chuck configured to hold a substrate. an infrared camera is arranged over the chuck and configured to detect an alignment mark below the substrate. the alignment mark is used to align the stealth laser apparatus over the chuck. control circuitry is configured to operate the stealth laser apparatus to form a stealth damage region at a location within the substrate that is determined based upon the alignment mark. the stealth damage region separates an inner region of the substrate from an outer region of the substrate.
