18237669. SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES simplified abstract (Applied Materials, Inc.)
SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES
Organization Name
Inventor(s)
Wolfgang R. Aderhold of Cupertino CA (US)
Aaron Muir Hunter of Santa Cruz CA (US)
Joseph M. Ranish of San Jose CA (US)
SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237669 titled 'SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES
Simplified Explanation
The present invention relates to an apparatus and method for reducing non-uniformity during thermal processing. The invention provides a chamber body with a processing volume, a substrate support that can rotate the substrate, a sensor assembly to measure temperature at multiple locations on the substrate, and pulse heating elements to provide pulsed energy to the processing volume.
- The invention aims to reduce non-uniformity during thermal processing.
- The apparatus includes a chamber body with a processing volume.
- A substrate support is provided within the processing volume, capable of rotating the substrate.
- A sensor assembly is included to measure the temperature of the substrate at various locations.
- One or more pulse heating elements are used to provide pulsed energy towards the processing volume.
Potential Applications
This technology can be applied in various industries and processes, including:
- Semiconductor manufacturing
- Thin film deposition
- Solar cell production
- LED fabrication
- Chemical vapor deposition
Problems Solved
The invention addresses the issue of non-uniformity during thermal processing, which can lead to inconsistent results and reduced product quality. By measuring the temperature at multiple locations on the substrate and providing pulsed energy, the invention helps to achieve more uniform heating and processing.
Benefits
The benefits of this technology include:
- Improved product quality and consistency
- Enhanced process control and efficiency
- Reduction in non-uniformity during thermal processing
- Increased yield and throughput
- Cost savings through improved energy utilization
Original Abstract Submitted
Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.
