Samsung electronics co., ltd. (20240128135). SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
DAESEOK Byeon of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128135 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a structure with stacked chips, a scribe lane, a dam structure, a detection wire, and a detection circuit to detect defects in the scribe lane.
- The device has a chip area where multiple chips are stacked.
- A scribe lane is located at the circumference of the chip area.
- A dam structure separates the chip area and the scribe lane.
- A detection wire extends from the chip area to the scribe lane through the dam structure.
- A detection circuit in the chip area is electrically connected to the detection wire and is designed to detect defects in the scribe lane.
Potential Applications
This technology could be applied in the semiconductor industry for quality control and defect detection in stacked chip structures.
Problems Solved
This technology helps in identifying defects in the scribe lane of stacked semiconductor chips, improving overall product quality and reliability.
Benefits
The detection system enhances the quality control process, leading to higher yield rates and improved performance of semiconductor devices.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers.
Possible Prior Art
There may be prior art related to defect detection systems in semiconductor devices, but specific examples are not provided in the patent application.
Unanswered Questions
How does the detection circuit differentiate between different types of defects in the scribe lane?
The patent application does not provide detailed information on how the detection circuit distinguishes between various types of defects in the scribe lane.
What is the impact of the detection wire passing through the dam structure on the overall performance of the semiconductor device?
The potential effects of the detection wire passing through the dam structure on the functionality and reliability of the semiconductor device are not addressed in the patent application.
Original Abstract Submitted
a semiconductor device with a structure in which a plurality of chips are stacked includes: a chip area; a scribe lane at a circumference of the chip area; a dam structure that separates the chip area and the scribe lane; a detection wire that extends from the chip area to the scribe lane by passing through the dam structure; and a detection circuit in the chip area that is electrically connected to the detection wire and is configured to detect a defect in the scribe lane.
