17814997. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Tien-Chung Yang of Hsinchu City (TW)

Li-Hsien Huang of Zhubei City (TW)

Ming-Feng Wu of Miaoli County (TW)

Yung-Sheng Liu of Hsinchu City (TW)

Chun-Jen Chen of Jhubei City (TW)

Jun He of Zhubei City (TW)

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17814997 titled 'SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

Simplified Explanation

The abstract of this patent application describes a laser grooving operation performed on a semiconductor die before attaching it to a semiconductor device package substrate. The purpose of this operation is to form grooves in the die, including a first groove for blade sawing to separate the die from others, and a second groove between the first groove and a seal ring of the die. The second groove is designed to contain any potential delamination that could propagate to the active region of the die. This laser grooving operation aims to reduce the likelihood of delamination caused by swelling or expansion in the molding compound surrounding the die after attachment to the substrate.

• A laser grooving operation is performed on a semiconductor die before attaching it to a substrate.
• The operation forms multiple grooves, including a first groove for separating the die and a second groove near the seal ring.
• The second groove is intended to contain delamination that could spread to the active region of the die.
• The purpose is to minimize delamination caused by swelling or expansion in the molding compound.

Potential Applications

• Semiconductor manufacturing industry
• Electronics packaging industry

Problems Solved

• Delamination in semiconductor dies caused by swelling or expansion in the molding compound
• Potential damage to the active region of the die during separation process

Benefits

• Reduced likelihood of delamination in semiconductor dies
• Enhanced reliability and performance of semiconductor devices
• Improved yield in semiconductor manufacturing process

Original Abstract Submitted

A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.