Samsung electronics co., ltd. (20240128236). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sunkyoung Seo of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128236 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes two semiconductor chips stacked on top of each other, with bonding pads and test pads exposed on the wiring layers of each chip. The passivation layers of the chips are directly bonded to each other, as well as the bonding pads of the chips.
- Explanation of the patent/innovation:
* The patent describes a semiconductor package with two stacked chips that are directly bonded to each other. * The package includes bonding pads and test pads exposed on the wiring layers of each chip. * The passivation layers of the chips are directly bonded to each other, providing a secure connection between the chips.
Potential Applications
This technology could be applied in:
- High-performance computing
- Telecommunications
- Automotive electronics
Problems Solved
- Improved signal transmission between stacked chips
- Enhanced reliability and durability of semiconductor packages
Benefits
- Increased performance and efficiency of electronic devices
- Reduced footprint of semiconductor packages
- Enhanced overall system reliability
Potential Commercial Applications
Optimizing Semiconductor Package Bonding for Improved Performance
Possible Prior Art
One possible prior art could be the use of wire bonding or flip chip technology in semiconductor packaging.
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
The cost implications of implementing this technology in semiconductor packaging are not addressed in the abstract. Further research and analysis would be needed to determine the cost-effectiveness of this approach.
What are the environmental implications of using this technology in electronic devices?
The environmental impact of the materials and processes involved in this technology is not discussed in the abstract. Additional studies would be required to assess the sustainability of implementing this technology in electronic devices.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. the first semiconductor chip includes a first wiring layer on a first substrate, and a first passivation layer on the first wiring layer and that exposes at least portions of first bonding pads and a first test pad that are on the second wiring layer. the second semiconductor chip includes a second wiring layer on a second substrate and a second passivation layer on the second wiring layer and that exposes at least portions of third bonding pads and second test pad that are provided on the second wiring layer. the first bonding pads and respective ones of the third bonding pads are directly bonded to each other. the first passivation layer and the second passivation layer are directly bonded to each other.
