Samsung electronics co., ltd. (20240103070). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240103070 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with an element region and a scribe lane region, along with test element groups containing test elements and test pads for evaluation and testing purposes. The test pads are positioned away from the element region horizontally.
- The semiconductor device includes a substrate with distinct regions for elements and testing.
- Test element groups on the substrate contain test elements and test pads for evaluation and testing.
- Test pads are strategically placed away from the element region horizontally.
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development and testing of new semiconductor devices. It could also be used in research and development laboratories for evaluating the characteristics of different materials and components.
Problems Solved
This technology solves the problem of efficiently testing and evaluating semiconductor devices without interfering with the element region. By separating the test pads from the element region, the testing process can be carried out accurately and effectively.
Benefits
The benefits of this technology include improved testing accuracy, enhanced evaluation of semiconductor characteristics, and increased efficiency in the development of semiconductor devices. By having dedicated test pads away from the element region, the risk of interference or damage to the elements is minimized.
Potential Commercial Applications
A potential commercial application of this technology could be in the semiconductor manufacturing industry, where companies could use this innovation to streamline their testing processes and improve the quality of their products. Research institutions and laboratories could also benefit from this technology for conducting experiments and evaluations on semiconductor materials.
Possible Prior Art
One possible prior art could be the use of separate test structures on semiconductor devices for evaluation and testing purposes. Another could be the development of specialized test pads for applying test signals in semiconductor testing processes.
Unanswered Questions
How does the placement of test pads away from the element region impact the overall testing process?
The placement of test pads away from the element region ensures that the testing process is conducted without interference or damage to the elements. This separation allows for accurate evaluation and testing of the semiconductor device's characteristics.
What are the potential challenges in implementing this technology in large-scale semiconductor manufacturing processes?
One potential challenge could be the integration of this technology into existing manufacturing processes without disrupting production efficiency. Another challenge could be the cost implications of incorporating specialized test pads into semiconductor devices on a mass scale.
Original Abstract Submitted
provided is a semiconductor device including a substrate including an element region and a scribe lane region defining the element region, and one or more test element groups arranged on the substrate and including one or more test elements for characteristic evaluation and one or more test pads for applying a test signal for testing the one or more test elements, wherein all of the one or more test pads are spaced apart from the element region in a horizontal direction.
