Samsung electronics co., ltd. (20240096714). SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096714 titled 'SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor chip described in the patent application includes a front end of line (FEOL) with an active layer, a back end of line (BEOL) with multiple metal layers including a wire, an optional dicing line for dicing, and an isolation block for processing signals when the wire is discontinuous due to dicing. The chip die has the active layer not formed around the cross section cut by the optional dicing line, improving production yield and reducing costs.
- Front end of line (FEOL) with active layer
- Back end of line (BEOL) with multiple metal layers including a wire
- Optional dicing line for dicing
- Isolation block for processing signals when wire is discontinuous
- Chip die with active layer not formed around dicing line
Potential Applications
The technology described in the patent application could be applied in the manufacturing of semiconductor chips for various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
Problems Solved
1. Improved production yield of semiconductor chips 2. Reduced production costs
Benefits
1. Increased efficiency in semiconductor chip manufacturing 2. Cost savings for manufacturers
Potential Commercial Applications
Optimizing Semiconductor Chip Manufacturing Process for Cost Efficiency
Possible Prior Art
There is no prior art mentioned in the patent application.
Unanswered Questions
How does the isolation block process signals when the wire is discontinuous?
The patent application mentions an isolation block that processes signals when the wire is discontinuous due to dicing. However, it does not provide specific details on how this process works.
What are the specific materials used in the active layer and metal layers of the semiconductor chip?
The patent application describes the structure of the semiconductor chip but does not mention the specific materials used in the active layer or metal layers. This information could be crucial for understanding the performance and durability of the chip.
Original Abstract Submitted
provided are a semiconductor chip and a method of manufacturing a semiconductor package including the semiconductor chip. the semiconductor chip includes a front end of line (feol) including an active layer, a back end of line (beol) including a plurality of metal layers including a wire, an optional dicing line along which dicing is optionally performed, and an isolation block configured to process a signal for a discontinuous wire when the wire is discontinuous by being diced along the optional dicing line, and a chip die on which the active layer is not formed around a cross section cut by the optional dicing line. thus, the production yield of the semiconductor chip may be improved, and the production costs thereof may be reduced.
