18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jungeun Koo of Hwaseong-si (KR)

Yechung Chung of Hwaseong-si (KR)

CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18051141 titled 'CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME

Simplified Explanation

The abstract describes a chip-on-film package for electronic devices. Here are the bullet points explaining the patent/innovation:

  • The chip-on-film package includes a base film with a circuit region, a source driver chip, and a gate driver chip mounted on the circuit region.
  • The base film has a top surface and a bottom surface, with a first conductive line on the top surface and a second conductive line on the bottom surface.
  • A conductive via connects the first and second conductive lines to each other.
  • The circuit region has a first row of bonding pads connected to the source driver chip and a second row of bonding pads connected to both the source driver chip and the gate driver chip.
  • A test pad outside the circuit region is connected to the first and second conductive lines and the conductive via.

Potential applications of this technology:

  • This chip-on-film package can be used in various electronic devices such as smartphones, tablets, and wearable devices.
  • It can be particularly useful in devices that require compact and lightweight packaging.

Problems solved by this technology:

  • The chip-on-film package provides a compact and efficient way to mount source driver and gate driver chips on a base film.
  • It allows for better integration of components and reduces the overall size of the electronic device.

Benefits of this technology:

  • The chip-on-film package offers a cost-effective solution for packaging electronic devices.
  • It provides improved electrical connectivity and signal transmission between the source driver and gate driver chips.
  • The compact design of the package allows for more flexibility in device design and enables thinner and lighter electronic devices.


Original Abstract Submitted

A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.

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