Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on February 29th, 2024
Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on February 29th, 2024
The patents recently filed by the organization describe innovative memory devices and semiconductor structures with unique compositions and configurations to enhance performance, reliability, and efficiency. These technologies aim to improve data storage capacity, data transfer speeds, and energy efficiency in electronic devices.
Notable applications of these patents include:
- Non-volatile memory devices
- High-speed data storage solutions
- Power generation in semiconductor devices
- Memory storage devices
- Consumer electronics
Overall, the patents focus on addressing key challenges in memory device performance, data storage capabilities, and power generation in semiconductor devices, offering benefits such as increased data storage capacity, faster data access speeds, and enhanced reliability and efficiency in electronic systems.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on February 29th, 2024
- 1.1 BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH (18500849)
- 1.2 BROADBAND WAFER DEFECT DETECTION (18387815)
- 1.3 WAVELENGTH TUNING IN SILICON PHOTONICS (18298574)
- 1.4 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17898427)
- 1.5 CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE (17895342)
- 1.6 PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF (17896089)
- 1.7 PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18116684)
- 1.8 METHOD OF MANUFACTURING PHOTO MASKS (18110838)
- 1.9 METHOD AND APPARATUS FOR DIFFRACTION-BASED OVERLAY MEASUREMENT (18504147)
- 1.10 ARTIFICIAL INTELLIGENCE ACCELERATOR DEVICE (17900471)
- 1.11 CIRCUIT CELLS HAVING POWER GRID STUBS (17821567)
- 1.12 LATCH TYPE SENSE AMPLIFIER (18504686)
- 1.13 MEMORY DEVICE AND MANUFACTURING METHOD AND TEST METHOD OF THE SAME (17896506)
- 1.14 FERROELECTRIC FIELD-EFFECT TRANSISTOR (FeFET) MEMORY (18447997)
- 1.15 EMBEDDED FERROELECTRIC MEMORY CELL (18506177)
- 1.16 MEMORY DEVICE AND OPERATING METHOD THEREOF (18499449)
- 1.17 Systems and Methods for Improved Data Access Speed (18503290)
- 1.18 MEMORY DEVICE AND METHOD FOR OPERATING THE SAME (17898733)
- 1.19 ONE-TIME PROGRAMMABLE MEMORY BIT CELL (18447826)
- 1.20 DC Bias in Plasma Process (18504415)
- 1.21 Volume-less Fluorine Incorporation Method (18150861)
- 1.22 TURNTABLE FOR WAFER TRANSPORT SYSTEM (17896374)
- 1.23 EMBEDDED SOI STRUCTURE FOR LOW LEAKAGE MOS CAPACITOR (17823508)
- 1.24 Conductive Via With Improved Gap Filling Performance (17895286)
- 1.25 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE (18504136)
- 1.26 METHOD FOR FORMING INTERCONNECT STRUCTURE (18498851)
- 1.27 LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING THE SAME (17900151)
- 1.28 System, Device and Methods of Manufacture (18503453)
- 1.29 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17822454)
- 1.30 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (17894097)
- 1.31 HYBRID FIN-DIELECTRIC SEMICONDUCTOR DEVICE (17895323)
- 1.32 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18504027)
- 1.33 Gate Structures For Semiconductor Devices (18388419)
- 1.34 SEMICONDUCTOR PACKAGE AND METHOD (17822470)
- 1.35 SEMICONDUCTOR PACKAGE AND METHOD (17822476)
- 1.36 MULTI-DIE PACKAGE AND METHODS OF FORMATION (17823856)
- 1.37 PACKAGE STRUCTURE (17896097)
- 1.38 SEMICONDUCTOR DEVICE (17900785)
- 1.39 SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE (18499964)
- 1.40 SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17894084)
- 1.41 PACKAGE STRUCTURE (17897206)
- 1.42 SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE (18502307)
- 1.43 SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF (18162071)
- 1.44 INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE (17896083)
- 1.45 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17897196)
- 1.46 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF (17897648)
- 1.47 SEMICONDUCTOR PACKAGE AND METHOD (17823157)
- 1.48 INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME (18152502)
- 1.49 METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE (18502086)
- 1.50 PACKAGE STRUCTURE (18506111)
- 1.51 THROUGH VIA WITH GUARD RING STRUCTURE (18304527)
- 1.52 Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same (18447840)
- 1.53 DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH (18387801)
- 1.54 Adaptive Interconnect Structure for Semiconductor Package (17822879)
- 1.55 METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18499242)
- 1.56 Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus (17895321)
- 1.57 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME (17895047)
- 1.58 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (18494784)
- 1.59 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17894095)
- 1.60 3DIC Package and Method Forming the Same (18151609)
- 1.61 SEMICONDUCTOR STRUCTURE WITH REDUCED PARASITIC CAPACITANCE AND METHOD FOR MANUFACTURING THE SAME (17900001)
- 1.62 GUARD RING STRUCTURE AND METHOD FORMING SAME (18301524)
- 1.63 Dielectric Walls for Complementary Field Effect Transistors (18151279)
- 1.64 VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF (18306004)
- 1.65 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17897151)
- 1.66 PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR (17822600)
- 1.67 STACKED CMOS IMAGE SENSOR (18150372)
- 1.68 SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF (18101254)
- 1.69 COMPLEMENTARY FIELD EFFECT TRANSISTOR WITH CONDUCTIVE THROUGH SUBSTRATE LAYER (18168504)
- 1.70 Sacrificial Layer for Semiconductor Process (18502183)
- 1.71 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17896353)
- 1.72 Performance Optimization By Sizing Gates And Source/Drain Contacts Differently For Different Transistors (17900639)
- 1.73 SEMICONDUCTOR DEVICE (18504473)
- 1.74 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17897201)
- 1.75 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (17900227)
- 1.76 CONTACT PLUGS AND METHODS FORMING SAME (18504745)
- 1.77 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17894169)
- 1.78 FINFET WITH LONG CHANNEL LENGTH STRUCTURE (17823507)
- 1.79 TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR (17896093)
- 1.80 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (17894614)
- 1.81 PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION (17895502)
- 1.82 DUAL BAND FAN OUT DEVICE AND METHOD (18151843)
- 1.83 INTERFACE DEVICE AND SIGNAL TRANSCEIVING METHOD THEREOF (17899623)
- 1.84 FLIP FLOP STANDARD CELL (18447955)
- 1.85 DIGITAL-TO-ANALOG CONVERTER AND OPERATION METHOD THEREOF (17990737)
- 1.86 LAYOUT OF STATIC RANDOM ACCESS MEMORY PERIPHERY CIRCUIT (18506122)
- 1.87 CAPACITORLESS DYNAMIC RANDOM ACCESS MEMORY AND METHODS OF FORMATION (17822390)
- 1.88 THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (18501137)
- 1.89 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (17896745)
- 1.90 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (18501360)
- 1.91 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17900804)
- 1.92 PHASE-CHANGE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME (17896060)
- 1.93 MEMORY DEVICE AND METHOD OF MAKING THE SAME (17896081)
Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on February 29th, 2024
BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH (18500849)
Main Inventor
Chia-Ling PAI
BROADBAND WAFER DEFECT DETECTION (18387815)
Main Inventor
Nai-Han CHENG
WAVELENGTH TUNING IN SILICON PHOTONICS (18298574)
Main Inventor
Beih-Tzun Lin
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17898427)
Main Inventor
Hung-Yi Kuo
CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE (17895342)
Main Inventor
Chan-Hong Chern
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF (17896089)
Main Inventor
Feng-Wei KUO
PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18116684)
Main Inventor
Ting-Pi SUN
METHOD OF MANUFACTURING PHOTO MASKS (18110838)
Main Inventor
Wei-Che HSIEH
METHOD AND APPARATUS FOR DIFFRACTION-BASED OVERLAY MEASUREMENT (18504147)
Main Inventor
Hung-Chih HSIEH
ARTIFICIAL INTELLIGENCE ACCELERATOR DEVICE (17900471)
Main Inventor
Xiaoyu SUN
CIRCUIT CELLS HAVING POWER GRID STUBS (17821567)
Main Inventor
Johnny Chiahao LI
LATCH TYPE SENSE AMPLIFIER (18504686)
Main Inventor
Hua-Hsin YU
MEMORY DEVICE AND MANUFACTURING METHOD AND TEST METHOD OF THE SAME (17896506)
Main Inventor
Min-Chiao YEH
FERROELECTRIC FIELD-EFFECT TRANSISTOR (FeFET) MEMORY (18447997)
Main Inventor
Perng-Fei Yuh
EMBEDDED FERROELECTRIC MEMORY CELL (18506177)
Main Inventor
Tzu-Yu Chen
MEMORY DEVICE AND OPERATING METHOD THEREOF (18499449)
Main Inventor
He-Zhou WAN
Systems and Methods for Improved Data Access Speed (18503290)
Main Inventor
Sanjeev Kumar Jain
MEMORY DEVICE AND METHOD FOR OPERATING THE SAME (17898733)
Main Inventor
Pei-Chun LIAO
ONE-TIME PROGRAMMABLE MEMORY BIT CELL (18447826)
Main Inventor
Meng-Sheng Chang
DC Bias in Plasma Process (18504415)
Main Inventor
Sheng-Liang Pan
Volume-less Fluorine Incorporation Method (18150861)
Main Inventor
Hsueh-Ju Chen
TURNTABLE FOR WAFER TRANSPORT SYSTEM (17896374)
Main Inventor
Guancyun Li
EMBEDDED SOI STRUCTURE FOR LOW LEAKAGE MOS CAPACITOR (17823508)
Main Inventor
Chung-Lei Chen
Conductive Via With Improved Gap Filling Performance (17895286)
Main Inventor
Tzu-Yu Lin
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE (18504136)
Main Inventor
Zi-Jheng Liu
METHOD FOR FORMING INTERCONNECT STRUCTURE (18498851)
Main Inventor
Chun-Kai Chen
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING THE SAME (17900151)
Main Inventor
Chin-Lung CHUNG
System, Device and Methods of Manufacture (18503453)
Main Inventor
Chen-Hua Yu
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17822454)
Main Inventor
Chi-Wei WU
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (17894097)
Main Inventor
Chia-Chu LIU
HYBRID FIN-DIELECTRIC SEMICONDUCTOR DEVICE (17895323)
Main Inventor
Yi-Huan Chen
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18504027)
Main Inventor
Hung-Li CHIANG
Gate Structures For Semiconductor Devices (18388419)
Main Inventor
Chun-Fai CHENG
SEMICONDUCTOR PACKAGE AND METHOD (17822470)
Main Inventor
Yi-Huan Liao
SEMICONDUCTOR PACKAGE AND METHOD (17822476)
Main Inventor
Jian-You Chen
MULTI-DIE PACKAGE AND METHODS OF FORMATION (17823856)
Main Inventor
Wen-Yi LIN
PACKAGE STRUCTURE (17896097)
Main Inventor
Chih-Wei Wu
SEMICONDUCTOR DEVICE (17900785)
Main Inventor
Chih-Chien Pan
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE (18499964)
Main Inventor
Xinyu Bao
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17894084)
Main Inventor
Zi-Jheng Liu
PACKAGE STRUCTURE (17897206)
Main Inventor
Chien-Chang Lin
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE (18502307)
Main Inventor
Yi-Wen WU
SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF (18162071)
Main Inventor
Harry-Haklay Chuang
INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE (17896083)
Main Inventor
Chia-Yu Ling
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17897196)
Main Inventor
Jung-Wei Cheng
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF (17897648)
Main Inventor
Ming-Fa Chen
SEMICONDUCTOR PACKAGE AND METHOD (17823157)
Main Inventor
Yu-Ling Tsai
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME (18152502)
Main Inventor
Chih-Chiang Tsao
METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE (18502086)
Main Inventor
Kai-Ming Chiang
PACKAGE STRUCTURE (18506111)
Main Inventor
Kai-Ming Chiang
THROUGH VIA WITH GUARD RING STRUCTURE (18304527)
Main Inventor
Chih Hsin YANG
Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same (18447840)
Main Inventor
Shih-Lien Linus Lu
DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH (18387801)
Main Inventor
Jun-De JIN
Adaptive Interconnect Structure for Semiconductor Package (17822879)
Main Inventor
Tung-Liang Shao
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18499242)
Main Inventor
Mao-Yen Chang
Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus (17895321)
Main Inventor
Yi-Jung Chen
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME (17895047)
Main Inventor
Tseng Hsing Lin
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (18494784)
Main Inventor
Wei-Yu Chen
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17894095)
Main Inventor
Tzuan-Horng Liu
3DIC Package and Method Forming the Same (18151609)
Main Inventor
Ching-Yu Huang
SEMICONDUCTOR STRUCTURE WITH REDUCED PARASITIC CAPACITANCE AND METHOD FOR MANUFACTURING THE SAME (17900001)
Main Inventor
Cheng-Ting CHUNG
GUARD RING STRUCTURE AND METHOD FORMING SAME (18301524)
Main Inventor
I-Shan Huang
Dielectric Walls for Complementary Field Effect Transistors (18151279)
Main Inventor
Cheng-Ting Chung
VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF (18306004)
Main Inventor
Chien-Te TU
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17897151)
Main Inventor
Shahaji B. MORE
PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR (17822600)
Main Inventor
Yu-Hung CHENG
STACKED CMOS IMAGE SENSOR (18150372)
Main Inventor
Chi-Hsien Chung
SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF (18101254)
Main Inventor
Yi-Chen LO
COMPLEMENTARY FIELD EFFECT TRANSISTOR WITH CONDUCTIVE THROUGH SUBSTRATE LAYER (18168504)
Main Inventor
Wei-Xiang You
Sacrificial Layer for Semiconductor Process (18502183)
Main Inventor
Tsan-Chun Wang
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17896353)
Main Inventor
Meng-Yu LIN
Performance Optimization By Sizing Gates And Source/Drain Contacts Differently For Different Transistors (17900639)
Main Inventor
Li-Hui Chen
SEMICONDUCTOR DEVICE (18504473)
Main Inventor
Bo-Wen HSIEH
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17897201)
Main Inventor
Kuan-Ting Pan
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (17900227)
Main Inventor
Tzu-Ging Lin
CONTACT PLUGS AND METHODS FORMING SAME (18504745)
Main Inventor
Kuo-Hua Pan
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17894169)
Main Inventor
Chen-Huang Huang
FINFET WITH LONG CHANNEL LENGTH STRUCTURE (17823507)
Main Inventor
Sung-Hsin Yang
TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR (17896093)
Main Inventor
Marcus Johannes Henricus Van Dal
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (17894614)
Main Inventor
Li-Wei Yin
PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION (17895502)
Main Inventor
Wen-Shiang Liao
DUAL BAND FAN OUT DEVICE AND METHOD (18151843)
Main Inventor
Wen-Shiang Liao
INTERFACE DEVICE AND SIGNAL TRANSCEIVING METHOD THEREOF (17899623)
Main Inventor
Bi-Yang Li
FLIP FLOP STANDARD CELL (18447955)
Main Inventor
Nick Samra
DIGITAL-TO-ANALOG CONVERTER AND OPERATION METHOD THEREOF (17990737)
Main Inventor
Ting-Hao Wang
LAYOUT OF STATIC RANDOM ACCESS MEMORY PERIPHERY CIRCUIT (18506122)
Main Inventor
Yangsyu LIN
CAPACITORLESS DYNAMIC RANDOM ACCESS MEMORY AND METHODS OF FORMATION (17822390)
Main Inventor
Yun-Feng KAO
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (18501137)
Main Inventor
Chao-I Wu
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (17896745)
Main Inventor
Meng-Han Lin
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (18501360)
Main Inventor
Fu-Chen CHANG
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17900804)
Main Inventor
Oreste Madia
PHASE-CHANGE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME (17896060)
Main Inventor
Shao-Ming Yu
MEMORY DEVICE AND METHOD OF MAKING THE SAME (17896081)
Main Inventor
Hengyuan Lee
