17822879. Adaptive Interconnect Structure for Semiconductor Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Adaptive Interconnect Structure for Semiconductor Package
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tung-Liang Shao of Hsinchu (TW)
Yu-Sheng Huang of Hemei Township (TW)
Adaptive Interconnect Structure for Semiconductor Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 17822879 titled 'Adaptive Interconnect Structure for Semiconductor Package
Simplified Explanation
The patent application describes a package with two components: one containing a semiconductor die with conductive pads and an adaptive interconnect structure, and the other containing an interconnect structure with second bond pads directly bonded to the first bond pads of the semiconductor die.
- The package includes a semiconductor die with conductive pads surrounded by an encapsulant.
- An adaptive interconnect structure on the semiconductor die includes conductive lines that physically and electrically contact the conductive pads.
- First bond pads on the semiconductor die physically and electrically contact the conductive lines.
- A second package component includes an interconnect structure with second bond pads directly bonded to the first bond pads of the semiconductor die.
- Each second bond pad is laterally offset from a corresponding conductive pad electrically coupled to it.
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- Potential Applications
- Integrated circuits
- Microelectronics
- Semiconductor packaging
- Problems Solved
- Improved electrical connections
- Enhanced reliability
- Increased performance
- Benefits
- Higher efficiency
- Better signal transmission
- Enhanced overall functionality
Original Abstract Submitted
A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.
