17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chia-Yu Ling of Hsinchu City (TW)
Katherine H Chiang of New Taipei City (TW)
Chung-Te Lin of Tainan City (TW)
INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17896083 titled 'INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
Simplified Explanation
The abstract describes an interposer substrate with a bridge device, memory, and through substrate via.
- Interposer substrate with:
* Substrate * Bridge device in the substrate * Memory in the substrate beside the bridge device * Through substrate via in the substrate beside the bridge device and memory
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- Potential Applications
- Advanced packaging technology in semiconductor industry
- High-performance computing applications
- Data storage devices
- Problems Solved
- Improved signal transmission between components
- Enhanced memory integration in package structures
- Increased data processing speed and efficiency
- Benefits
- Higher performance and reliability in electronic devices
- More compact and efficient package structures
- Improved overall system functionality and speed
Original Abstract Submitted
Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the bridge device and a through substrate via in the substrate and beside the bridge device and the memory.
