18162071. SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Harry-Haklay Chuang of Zhubei City (TW)
Wen-Tuo Huang of Tainan City (TW)
Li-Feng Teng of Hsinchu City (TW)
Wei-Cheng Wu of Zhubei City (TW)
Yu-Jen Wang of Hsinchu City (TW)
SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18162071 titled 'SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF
Simplified Explanation
The semiconductor device described in the patent application includes:
- A first die with a first bonding layer
- A second die with a second bonding layer bonded to the first bonding layer
- A plurality of bonding members extending within the first and second bonding layers
- The bonding members include a connecting member electrically connected to conductive patterns in the first and second dies, and a dummy member electrically isolated from the conductive patterns
- An inductor within the bonding layers
Potential applications of this technology:
- Integrated circuits
- Power electronics
- Wireless communication devices
Problems solved by this technology:
- Improved electrical connectivity between different dies
- Efficient inductor integration in semiconductor devices
Benefits of this technology:
- Enhanced performance of semiconductor devices
- Increased functionality in a smaller footprint
- Cost-effective manufacturing process
Original Abstract Submitted
A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.
