18500849. BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chia-Ling Pai of Taichung City (TW)
Yu-Min Chang of Hsinchu City (TW)
BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH - A simplified explanation of the abstract
This abstract first appeared for US patent application 18500849 titled 'BREAKING-IN AND CLEANING METHOD AND APPARATUS FOR WAFER-CLEANING BRUSH
Simplified Explanation
The method of cleaning wafer-cleaning brushes involves rotating a wafer between a pair of cylindrical shaped brushes while applying a cleaning solution.
- Wafer-cleaning brushes are rotated in an axial direction while passing the wafer between them.
- A cleaning solution is applied to the brushes during the cleaning process.
- The wafer's polished main side faces a direction opposite to that of a production wafer during subsequent cleaning.
- The brushes have protrusions on their external surface and contact the wafer as it passes between them.
Potential Applications
- Semiconductor manufacturing
- Electronics industry
- Solar panel production
Problems Solved
- Ensures effective cleaning of wafer-cleaning brushes
- Prevents contamination during wafer processing
Benefits
- Improved wafer cleaning process
- Enhanced quality control in manufacturing
- Extended lifespan of wafer-cleaning brushes
Original Abstract Submitted
A method of cleaning wafer-cleaning brushes includes passing a wafer having a first polished main side and an opposing unpolished backside between a pair of substantially cylindrical shaped wafer-cleaning brushes are rotated about an axial direction of the brushes while passing the wafer between the pair of wafer-cleaning brushes. A cleaning solution is applied to the brushes while passing the wafer between the pair of wafer-cleaning brushes. While passing between the pair of brushes, the first polished main side of the wafer faces a first direction, the first direction is an opposite direction to which a polished side of a production wafer faces during a subsequent polished wafer cleaning operation. The substantially cylindrical shaped wafer-cleaning brushes include a plurality of protrusions on an external surface of the brushes, and the brushes contact the wafer at least a portion of time the wafer is passing between the pair of brushes.
