17895502. PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wen-Shiang Liao of Toufen Township (TW)
PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17895502 titled 'PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION
Simplified Explanation
- Device and method for integrating a receive transmit integrated circuit die and embedded antenna
- Oscillation region aligned to embedded antenna with a cavity in the substrate for RF signal passage
- Simplified explanation: A device and method for integrating a circuit die and antenna with a cavity for RF signal passage
Potential Applications
- Wireless communication devices
- Internet of Things (IoT) devices
- RFID technology
Problems Solved
- Integration of circuit die and antenna
- Efficient RF signal transmission and reception
Benefits
- Compact design
- Improved signal quality
- Cost-effective solution
Original Abstract Submitted
Embodiments provide an integrated package device and method of forming the same, the device including a receive transmit integrated circuit die and embedded antenna. An oscillation region is aligned to the embedded antenna and a cavity is provided in the substrate to allow the passage of radio frequency (RF) signals into and out of the oscillation region.
