17896089. PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Feng-Wei Kuo of Hsinchu County (TW)
Hsing-Kuo Hsia of Hsinchu County (TW)
Chih-Wei Tseng of Hsinchu City (TW)
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17896089 titled 'PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a package structure that includes photonic dies and an interposer structure for optical coupling.
- Photonic dies consist of a dielectric layer and a first grating coupler embedded in the dielectric layer.
- The interposer structure, located below the photonic dies, contains an oxide layer and a second grating coupler embedded in the oxide layer.
- Optical coupling is achieved through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
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- Potential Applications
- Data communication systems
- Optical interconnects
- Photonic integrated circuits
- Problems Solved
- Efficient optical coupling between photonic dies
- Integration of photonic components in a compact package structure
- Benefits
- Improved optical performance
- Higher data transfer rates
- Compact and cost-effective package structure
Original Abstract Submitted
A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
