17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Yi-Huan Liao of Hsinchu (TW)

Ping-Yin Hsieh of Hsinchu (TW)

Chih-Hao Chen of Taipei City (TW)

Pu Wang of Hsinchu (TW)

Li-Hui Cheng of New Taipei City (TW)

Ying-Ching Shih of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17822470 titled 'SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation

The semiconductor package includes two different adhesives for bonding components together.

• Package component with semiconductor die bonded to a substrate.
• First adhesive encircling the package component and heat transfer layer.
• Heat transfer layer on the package component.
• Lid attached to the substrate by a second adhesive.
• Lid includes a top portion on the heat transfer layer and first adhesive, and a bottom portion attached to the substrate.
• Material of the second adhesive is different from the material of the first adhesive.

Potential Applications

• Semiconductor packaging industry
• Electronics manufacturing

Problems Solved

• Improved bonding of components in semiconductor packages
• Enhanced heat transfer capabilities

Benefits

• Better overall performance of semiconductor packages
• Increased reliability and durability
• Enhanced thermal management properties

Original Abstract Submitted

A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.