18502307. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yi-Wen Wu of New Taipei City (TW)
Techi Wong of Zhubei City (TW)
Po-Hao Tsai of Zhongli City (TW)
Po-Yao Chuang of Hsin-Chu (TW)
Shih-Ting Hung of New Taipei City (TW)
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18502307 titled 'SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
Simplified Explanation
The semiconductor package described in the patent application includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure consists of an insulating base with insulating features and first conductive features formed on its first surface, extending into the encapsulating layer.
- The semiconductor package includes an encapsulating layer, a semiconductor die, and an interposer structure.
- The interposer structure has an insulating base with insulating features and first conductive features on its first surface.
- The insulating features are arranged in a matrix and face the top surface of the semiconductor die.
- The first conductive features surround the matrix of insulating features.
Potential Applications
- Advanced semiconductor packaging technology
- Improved thermal management in electronic devices
- Enhanced electrical performance in semiconductor devices
Problems Solved
- Improved reliability and durability of semiconductor packages
- Better heat dissipation in electronic devices
- Enhanced signal integrity in semiconductor components
Benefits
- Increased performance and efficiency of electronic devices
- Extended lifespan of semiconductor packages
- Enhanced overall reliability of electronic systems
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.
