17900785. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Chien Pan of Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
Ying-Ching Shih of Hsinchu City (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17900785 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a package substrate, a package component, and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer on it, while the adhesive pattern has a first surface facing the package substrate and a second surface that is coplanar with the TIM layer.
- The semiconductor device includes a package substrate, package component, and adhesive pattern.
- The package component has a TIM layer, and the adhesive pattern is coplanar with the TIM layer.
Potential Applications
- Semiconductor industry for improved thermal management in devices.
- Electronics industry for enhanced performance and reliability of components.
Problems Solved
- Improved thermal conductivity between package substrate and component.
- Reduced thermal resistance for better heat dissipation.
Benefits
- Enhanced thermal performance of semiconductor devices.
- Increased reliability and longevity of electronic components.
- Improved overall efficiency of electronic systems.
Original Abstract Submitted
A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.
