18387815. BROADBAND WAFER DEFECT DETECTION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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BROADBAND WAFER DEFECT DETECTION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Nai-Han Cheng of Hsinchu (TW)

Hsing-Piao Hsu of Taoyuan City (TW)

BROADBAND WAFER DEFECT DETECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18387815 titled 'BROADBAND WAFER DEFECT DETECTION

Simplified Explanation

- System includes broadband light source, wafer, light sensors, and detector module - First light sensor detects reflected light from first side of wafer - Second light sensor detects emergent light from second side of wafer - Detector module analyzes reflected and emergent light to identify wafer defects

Potential Applications

- Quality control in semiconductor manufacturing - Defect detection in wafer production processes

Problems Solved

- Early detection of defects in wafers - Improved quality control in manufacturing processes

Benefits

- Increased efficiency in production processes - Reduction in defective products - Cost savings through early defect identification


Original Abstract Submitted

In an embodiment, a system includes: a broadband light source; a wafer with a first side facing the broadband light source; a first light sensor configured to detect reflected light from the broadband light source emanating from the first side; a second light sensor configured to detect emergent light emanating from a second side of the wafer opposite the first side, wherein the emergent light originates from the broadband light source; and a detector module configured to analyze the reflected light and the emergent light to identify wafer defects.