18387801. DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Jun-De Jin of Hsinchu City (TW)

DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18387801 titled 'DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH

Simplified Explanation

    • Explanation:**

The patent application discloses devices and methods for improving the insertion loss performance of an antenna switch. One example provided is a semiconductor device designed to function as an antenna switch. The device includes a substrate, a dielectric layer, and a polysilicon region.

    • Bullet Points:**
  • Semiconductor device designed for use as an antenna switch
  • Includes substrate, dielectric layer, and polysilicon region
  • Substrate consists of intrinsic substrate, metal-oxide-semiconductor device, and isolation feature
  • Isolation feature is in contact with intrinsic substrate and positioned adjacent to the metal-oxide-semiconductor device
    • Potential Applications:**
  • Mobile devices
  • Wireless communication systems
  • Internet of Things (IoT) devices
    • Problems Solved:**
  • Improves insertion loss performance of antenna switches
  • Enhances overall efficiency of wireless communication systems
    • Benefits:**
  • Better signal transmission quality
  • Increased reliability of antenna switches
  • Improved performance of electronic devices


Original Abstract Submitted

Devices and methods for enhancing insertion loss performance of an antenna switch are disclosed. In one example, a semiconductor device formed to serve as an antenna switch is disclosed. The semiconductor device includes: a substrate, a dielectric layer and a polysilicon region. The substrate includes: an intrinsic substrate; a metal-oxide-semiconductor device extending into the intrinsic substrate; and at least one isolation feature extending into and in contact with the intrinsic substrate. The at least one isolation feature is disposed adjacent to the metal-oxide-semiconductor device.