17897206. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chien-Chang Lin of New Taipei City (TW)

Yen-Fu Su of Hsinchu City (TW)

Chin-Liang Chen of Kaohsiung City (TW)

Wei-Yu Chen of Hsinchu City (TW)

Hsin-Yu Pan of Taipei (TW)

Yu-Min Liang of Taoyuan City (TW)

Hao-Cheng Hou of Hsinchu City (TW)

Chi-Yang Yu of Taoyuan City (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17897206 titled 'PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a package structure for a semiconductor device, including a redistribution circuit structure, wiring substrate, conductive terminals, insulating encapsulation, and the semiconductor device.

• The redistribution circuit structure consists of stacked dielectric layers, redistribution wirings, and first conductive pads.
• The first conductive pads are located on the outermost dielectric layer and are connected to outermost redistribution pads through via openings.
• The wiring substrate contains second conductive pads.
• The first conductive terminals are positioned between the first conductive pads and the second conductive pads.
• The insulating encapsulation covers the surface of the redistribution circuit structure and encloses the wiring substrate laterally.

Potential applications of this technology:

• Semiconductor packaging industry
• Electronic devices manufacturing

Problems solved by this technology:

• Improved electrical connections between different components
• Enhanced protection and insulation for the semiconductor device

Benefits of this technology:

• Increased reliability and performance of the semiconductor device
• Simplified manufacturing process
• Enhanced durability and longevity of the package structure

Original Abstract Submitted

A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate.