17898427. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hung-Yi Kuo of Taipei City (TW)

Chen-Hua Yu of Hsinchu City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Che-Hsiang Hsu of Taichung City (TW)

Chung-Ming Weng of Taichung City (TW)

Tsung-Yuan Yu of Taipei City (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17898427 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor package described in the abstract includes a first die stack structure, a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure, and at least one reflector.

  • The first die stack structure and the second die stack structure are spaced apart from each other along a first direction.
  • Each die stack structure contains an electronic die and a photonic die that communicate electronically.
  • The insulating encapsulation surrounds the first and second die stack structures.
  • The redistribution structure is located on the die stack structures and the encapsulation, and is electrically connected to them.
  • At least one prism structure is within the redistribution structure and optically coupled to the photonic die.
  • At least one reflector is placed on the prism structure.

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      1. Potential Applications
  • Data communication systems
  • Optical networking devices
  • High-speed computing systems
      1. Problems Solved
  • Integration of electronic and photonic components in a compact package
  • Efficient optical communication within a semiconductor device
      1. Benefits
  • Enhanced data transfer speeds
  • Reduced footprint of electronic and photonic components
  • Improved performance and reliability of semiconductor devices


Original Abstract Submitted

A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die. The at least one reflector is disposed on the at least one prism structure.

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