17895321. Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yi-Jung Chen of Yilan City (TW)
Tsung-Fu Tsai of Changhua City (TW)
Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 17895321 titled 'Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus
Simplified Explanation
- Device bonding apparatus for attaching a die to a wafer
- First bond head with a vacuum channel for carrying the die to the wafer
- Second bond head for pressing the die against the wafer, with an elastic head having different thickness in center and edge portions
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
Problems Solved
- Precise and reliable bonding of dies to wafers
- Ensuring proper attachment force and pressure during bonding process
Benefits
- Improved efficiency in device bonding process
- Enhanced quality and consistency in die attachment
- Reduced risk of damage to components during bonding
Original Abstract Submitted
In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and a second bond head configured to press the die against the wafer, the second bond head including a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the second thickness.
