18151279. Dielectric Walls for Complementary Field Effect Transistors simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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Dielectric Walls for Complementary Field Effect Transistors

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Cheng-Ting Chung of Hsinchu City (TW)

Yi-Bo Liao of Hsinchu (TW)

Jin Cai of Hsinchu City (TW)

Dielectric Walls for Complementary Field Effect Transistors - A simplified explanation of the abstract

This abstract first appeared for US patent application 18151279 titled 'Dielectric Walls for Complementary Field Effect Transistors

Simplified Explanation

The patent application describes a device with nanostructures abutting a dielectric wall, lower and upper source/drain regions adjacent to different subsets of the nanostructures, and a shared source/drain contact extending into the dielectric wall.

  • Nanostructures abut a dielectric wall
  • Lower and upper source/drain regions are connected to different subsets of nanostructures
  • Upper source/drain region is oppositely doped from the lower source/drain region
  • Shared source/drain contact extends into the dielectric wall

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      1. Potential Applications
  • Advanced semiconductor devices
  • High-performance transistors
  • Nanoelectronics
      1. Problems Solved
  • Improved performance and efficiency of semiconductor devices
  • Enhanced control over charge carriers in transistors
  • Reduction of leakage currents
      1. Benefits
  • Increased speed and reliability of electronic devices
  • Lower power consumption
  • Miniaturization of electronic components


Original Abstract Submitted

In an embodiment, a device includes: a dielectric wall; nanostructures abutting the dielectric wall; a lower source/drain region adjoining a lower subset of the nanostructures; an upper source/drain region adjoining an upper subset of the nanostructures, the upper source/drain region oppositely doped from the lower source/drain region; and a shared source/drain contact contacting the upper source/drain region and the lower source/drain region, the shared source/drain contact extending into the dielectric wall.