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Category:H01L23/538
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Pages in category "H01L23/538"
The following 173 pages are in this category, out of 380 total.
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- 20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
- 20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088006.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
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- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on February 8th, 2024
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- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113009). POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract
- Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
- Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240113073). SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
- Intel corporation (20240128138). EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract
- Intel corporation (20240128205). HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract
- Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
- Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
- International business machines corporation (20240112965). TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract
- International Business Machines Corporation patent applications on April 4th, 2024
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- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract
- QUALCOMM Incorporated patent applications on February 15th, 2024
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on February 29th, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
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- Samsung electronics co., ltd. (20240096773). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096820). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240096851). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105541). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105662). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105703). FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240112998). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113057). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120280). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128195). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240130144). SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract
- Samsung electronics co., ltd. (20240136341). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240096647). HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096719). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096760). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096781). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096837). PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096849). SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128120). PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128194). Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128232). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105627). Semiconductor Devices and Methods of Manufacture simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105629). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105631). Three-Dimensional Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105632). Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112924). INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113032). PACKAGED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120315). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136293). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136299). SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Texas Instruments Incorporated patent applications on February 1st, 2024
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- US Patent Application 17751234. Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- US Patent Application 17752941. VIA STRUCTURE FOR EMBEDDED COMPONENT AND METHOD FOR MAKING SAME simplified abstract
- US Patent Application 17823063. SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF simplified abstract
- US Patent Application 17824353. SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION simplified abstract
- US Patent Application 17825336. VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS simplified abstract
- US Patent Application 17825340. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN simplified abstract
- US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract
- US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
- US Patent Application 17898834. INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18069318. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18098972. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18140985. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18150557. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE simplified abstract
- US Patent Application 18191092. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18230546. SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract
- US Patent Application 18231773. FLEXIBLE DISPLAY MODULE AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 18232523. SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH simplified abstract
- US Patent Application 18232713. Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via simplified abstract
- US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18316962. Embedded Packaging Concepts for Integration of ASICs and Optical Components simplified abstract
- US Patent Application 18346319. Integrated Circuit Package and Method Forming Same simplified abstract
- US Patent Application 18358714. CHIP PACKAGE STRUCTURE simplified abstract
- US Patent Application 18358904. METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR simplified abstract
- US Patent Application 18360656. PACKAGE WITH FAN-OUT STRUCTURES simplified abstract
- US Patent Application 18361480. CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR simplified abstract
- US Patent Application 18361917. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18362968. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18366282. Antenna Apparatus and Method simplified abstract
- US Patent Application 18446076. STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE simplified abstract
- US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18446291. Semiconductor Devices and Methods of Manufacturing simplified abstract
- US Patent Application 18446521. Integrated Circuit Package and Method simplified abstract
- US Patent Application 18446562. Polymer Layer in Semiconductor Device and Method of Manufacture simplified abstract
- US Patent Application 18447535. SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME simplified abstract
- US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract
- US Patent Application 18450216. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract