Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Cary Kuliasha of Mesa AZ (US)

Siddharth K. Alur of Chandler AZ (US)

Jung Kyu Han of Chandler AZ (US)

Beomseok Choi of Chandler AZ (US)

Russell K. Mortensen of Chandler AZ (US)

Andrew Collins of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240114622 titled 'EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE

Simplified Explanation

The electronic device described in the patent application includes a substrate with a core layer, a cavity in the core layer with conductive sidewalls, a passive electronic component in the cavity, and a cavity sidewall connection for electrical continuity.

• The device has a substrate with a core layer.
• A cavity is formed in the core layer with conductive sidewalls plated with a conductive material.
• A prefabricated passive electronic component is placed in the cavity.
• A cavity sidewall connection provides electrical continuity from the plated sidewalls to both surfaces of the substrate.

Potential Applications

This technology could be used in:

• Electronic devices
• Circuit boards
• Wearable technology

Problems Solved

This technology helps with:

• Efficient use of space
• Enhanced electrical connectivity
• Integration of passive electronic components

Benefits

The benefits of this technology include:

• Improved performance
• Space-saving design
• Enhanced reliability

Potential Commercial Applications

This technology could be applied in:

• Consumer electronics
• Medical devices
• Automotive electronics

Possible Prior Art

One possible prior art for this technology could be:

• Embedding electronic components in substrates for compact designs.

Unanswered Questions

How does this technology impact the cost of manufacturing electronic devices?

This article does not provide information on the cost implications of implementing this technology in electronic devices.

What materials are used for the conductive sidewalls in the cavity?

The article does not specify the exact materials used for the conductive sidewalls in the cavity.

Original Abstract Submitted

an electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.