US Patent Application 18447535. SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME simplified abstract

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SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Daeho Lee of Hwaseong-si (KR)]]

[[Category:Kilsoo Kim of Hwaseong-si (KR)]]

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447535 titled 'SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

Simplified Explanation

The patent application describes a semiconductor package design that includes multiple layers and ball pads for improved functionality and performance.

  • The semiconductor package includes a lower redistribution layer with multiple lower ball pads grouped together.
  • A semiconductor chip is placed on top of the lower redistribution layer.
  • An expanded layer surrounds the semiconductor chip on the lower redistribution layer.
  • An upper redistribution layer is placed on top of the semiconductor chip and expanded layer.
  • The upper redistribution layer has multiple upper ball pads grouped together.
  • The number of upper ball pad groups is the same as the number of lower ball pad groups.
  • Some of the upper ball pads in each group may be dummy ball pads, which are not connected to any external components.


Original Abstract Submitted

A semiconductor package includes a lower redistribution layer having a plurality of lower ball pads forming a plurality of lower ball pad groups, a semiconductor chip on the lower redistribution layer, an expanded layer surrounding the semiconductor chip on the lower redistribution layer, and an upper redistribution layer on the semiconductor chip and the expanded layer and having a plurality of upper ball pads forming a plurality of upper ball pad groups. The number of the plurality of upper ball pad groups may be the same as the number of the of the plurality lower ball pad groups. Each of the upper ball pads in one of the plurality of upper ball pad groups, from among the plurality of upper ball pads, may be a dummy ball pad.

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