US Patent Application 18450216. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract

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SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Organization Name

SK hynix Inc.

Inventor(s)

Seung Hwan Kim of Icheon-si Gyeonggi-do (KR)

Hyun Chul Seo of Icheon-si Gyeonggi-do (KR)

Hyeong Seok Choi of Icheon-si Gyeonggi-do (KR)

Moon Un Hyun of Icheon-si Gyeonggi-do (KR)

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18450216 titled 'SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Simplified Explanation

The patent application describes a semiconductor chip with through electrodes arranged in an array region.

  • The chip has a body part with a front surface and a rear surface.
  • Through electrodes penetrate the body part and are arranged in a first direction in the array region.
  • Front surface connection electrodes are coupled to the through electrodes over the front surface.
  • Rear surface connection electrodes are coupled to the through electrodes over the rear surface.
  • The array region includes a central region and edge regions on both sides of the central region.
  • In the edge regions, the center of the front surface connection electrode and the center of the rear surface connection electrode are positioned farther from the central region than the center of the corresponding through electrode.


Original Abstract Submitted

A semiconductor chip includes a body part having a front surface and a rear surface, a plurality of through electrodes penetrating the body part and arranged in a first direction in an array region, a plurality of front surface connection electrodes respectively coupled to the through electrodes over the front surface of the body part, and a plurality of rear surface connection electrodes respectively coupled to the through electrodes over the rear surface of the body part. The array region includes a central region and edge regions positioned on both sides of the central region in the first direction. A center of the front surface connection electrode and a center of the rear surface connection electrode that are positioned in each of the edge regions are positioned at a distance farther from the central region than a center of the corresponding through electrode.

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