US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chen-Hua Yu of Hsinchu City (TW)

Chun-Lin Lu of Hsinchu City (TW)

Han-Ping Pu of Taichung (TW)

Kai-Chiang Wu of Hsinchu City (TW)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18363769 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The patent application describes a package structure for semiconductor devices.

• The package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures.
• The semiconductor die is encapsulated in the insulating encapsulation.
• The redistribution circuit structure is located on the insulating encapsulation and is electrically connected to the semiconductor die.
• The first reinforcement structures are embedded in the redistribution circuit structure.
• The package structure has a polygonal shape when viewed from above, and the first reinforcement structures are located along diagonal lines of the package structure.

Original Abstract Submitted

A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.