Samsung electronics co., ltd. (20240105541). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yonghwan Kwon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105541 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes multiple layers of redistribution wiring, semiconductor substrates with semiconductor chips, through vias, and heat dissipation structures.
- The package consists of a first redistribution wiring layer with wires and bonding pads, a first semiconductor substrate with a semiconductor chip and through vias, a second redistribution wiring layer, and a second semiconductor substrate with a semiconductor chip.
- The first semiconductor substrate has a heat dissipation structure surrounding the semiconductor chip, while the second semiconductor substrate also has a heat dissipation structure around its chip.
- The through vias in the first semiconductor substrate connect the first redistribution wiring layer to the second redistribution wiring layer, allowing for electrical connections between the semiconductor chips.
Potential Applications
This technology could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require efficient heat dissipation and reliable electrical connections.
Problems Solved
This technology solves the problem of heat buildup in semiconductor packages, which can affect the performance and reliability of electronic devices. The heat dissipation structures help to dissipate heat effectively, while the through vias ensure reliable electrical connections between the semiconductor chips.
Benefits
The benefits of this technology include improved thermal management, enhanced reliability, and increased performance of electronic devices. The heat dissipation structures help to prevent overheating, while the through vias ensure stable electrical connections, reducing the risk of malfunctions.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing companies, and companies producing consumer electronics. This technology could be integrated into various electronic devices to improve their performance and reliability.
Possible Prior Art
One possible prior art for this technology could be the use of heat dissipation structures in semiconductor packages to improve thermal management. Additionally, the use of through vias for electrical connections between semiconductor chips may also be considered prior art in the semiconductor industry.
Unanswered Questions
How does this technology compare to existing solutions for heat dissipation in semiconductor packages?
This article does not provide a direct comparison between this technology and existing solutions for heat dissipation in semiconductor packages. Further research or testing may be needed to determine the effectiveness and efficiency of this technology compared to other solutions.
What impact could this technology have on the cost of manufacturing electronic devices?
The article does not address the potential impact of this technology on the cost of manufacturing electronic devices. It would be interesting to explore whether the implementation of this technology could lead to cost savings or increased production costs for electronic manufacturers.
Original Abstract Submitted
a semiconductor package includes a first redistribution wiring layer including a first redistribution wiring layer having a plurality of first redistribution wires, and a plurality of first bonding pads electrically connected to the first redistribution wires and exposed from a lower surface, a first semiconductor substrate on an upper surface of the plurality of first redistribution wiring layer, the first semiconductor substrate having at least one first semiconductor chip and through vias that are electrically connected to the first redistribution wires, and the first semiconductor substrate having a first heat dissipation structure that surrounds an outer surface of the first semiconductor chip, a second redistribution wiring layer on the first semiconductor substrate, and the second redistribution having a plurality of second redistribution wires that are electrically connected to the through vias, and a second semiconductor substrate having at least one second semiconductor chip that is electrically connected to the plurality of second redistribution wires, and a second heat dissipation structure surrounding an outer surface of the second semiconductor chip.
