US Patent Application 18446076. STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE simplified abstract
Contents
STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Jen-Yuan Chang of Hsinchu City (TW)]]
STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446076 titled 'STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE
Simplified Explanation
- The patent application describes a stacked semiconductor device with a cooling structure to improve its cooling efficiency. - The cooling structure includes different cooling components integrated into the device to remove and dissipate heat from the semiconductor dies. - The purpose of the cooling structure is to reduce device failures and enable the stacked semiconductor device to operate at higher voltages, speeds, and performance levels. - The cooling structure helps in removing and dissipating heat from the stacked semiconductor device, which is crucial for its optimal functioning.
Original Abstract Submitted
A stacked semiconductor device includes a cooling structure to increase the cooling efficiency of the stacked semiconductor device. The cooling structure includes various types of cooling components integrated into the stacked semiconductor device that are configured to remove and/or dissipate heat from dies of the stacked semiconductor device. In this way, the cooling structure reduces device failures and permits the stacked semiconductor device to operate at greater voltages, greater speeds, and/or other increased performance parameters by removing and/or dissipating heat from the stacked semiconductor device.
