Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Bo-Tao Chen of Taipei City (TW)
An-Jhih Su of Taoyuan City (TW)
Ming-Shih Yeh of Hsinchu County (TW)
Der-Chyang Yeh of Hsin-Chu (TW)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096811 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The present disclosure describes a package structure and a method of manufacturing a package for a semiconductor die. The package structure includes a semiconductor die encapsulated by an encapsulant, a redistribution structure, and bumps. The redistribution structure is electrically connected to the semiconductor die and is disposed on the die and the encapsulant. The bumps are located on the redistribution structure, which consists of dielectric layers and metallic pattern layers sandwiched between the dielectric layers. The outermost dielectric layer of the redistribution structure has metallic pads with undercut cavities beside them.
- Semiconductor die encapsulated by an encapsulant
- Redistribution structure electrically connected to the semiconductor die
- Bumps located on the redistribution structure
- Redistribution structure made up of dielectric and metallic pattern layers
- Metallic pads on the outermost dielectric layer with undercut cavities
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor packages for various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor dies to external components while providing protection and stability to the overall package structure.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced structural integrity, and potentially increased performance of electronic devices utilizing these semiconductor packages.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of similar redistribution structures in semiconductor packaging, but with different configurations or materials.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness and performance?
This article does not provide a direct comparison with existing semiconductor packaging methods, so it is unclear how this technology fares in terms of cost-effectiveness and performance.
What are the specific electronic devices that could benefit the most from this advanced semiconductor packaging technology?
The article does not specify the specific electronic devices that could benefit the most from this technology, leaving room for further exploration and analysis in this area.
Original Abstract Submitted
the present disclosure provides a package structure and a method of manufacturing a package. the package structure includes a semiconductor die laterally encapsulated by an encapsulant, a redistribution structure and bumps. the redistribution structure is disposed on the semiconductor die and the encapsulant, and is electrically connected with the at least one semiconductor die. the bumps are disposed on the redistribution structure. the redistribution structure includes dielectric layers and metallic pattern layers sandwiched between the dielectric layers. the redistribution structure includes metallic pads on an outermost dielectric layer of the dielectric layers, and the outmost dielectric layer has undercut cavities beside the metallic pads.
