Taiwan semiconductor manufacturing co., ltd. (20240096719). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Sung-Hui Huang of Yilan County (TW)
Chien-Yuan Huang of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096719 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor device described in the patent application includes a first substrate, an electronic component, and a lid. The first substrate has a top side, a bottom side, a lateral side, and a connector structure. The electronic component is connected to the top side of the first substrate and the connector structure. The lid consists of a wall part with a ring part, an overhang part with a first part connected to the lateral side of the first substrate, and a second part extending from the first part away from the lateral side.
- First substrate with top, bottom, and lateral sides
- Electronic component connected to the top side of the first substrate
- Lid with wall part, ring part, and overhang part
- Overhang part extending from the lateral side of the first substrate
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of protecting electronic components within a semiconductor device while providing a secure and efficient connection between the components and the substrate.
Benefits
The benefits of this technology include improved durability, reliability, and performance of semiconductor devices. It also allows for easier assembly and maintenance of electronic components.
Potential Commercial Applications
The potential commercial applications of this technology include the production of consumer electronics, industrial equipment, and automotive systems.
Possible Prior Art
One possible prior art for this technology could be the use of similar lid structures in semiconductor devices to protect electronic components and facilitate connections.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What are the environmental implications of implementing this technology in semiconductor devices?
This article does not address the environmental implications of implementing this technology in semiconductor devices.
Original Abstract Submitted
a semiconductor device includes a first substrate, an electronic component, and a lid. the first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. the electronic component is coupled to the first substrate top side and coupled to the connector structure. the lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.
